Evaluate the full thermal performance of a reflow oven in 15 minutes — so you can double equipment life and fully optimize the process. The Reflow Explorer pairs differential heat-capacity modules, the R9E3 data recorder and ERES analysis software to benchmark an oven’s real thermal behavior, not just a single board.
Pricing: Request a QuoteThe RE5050D Reflow Explorer is a purpose-built instrument for evaluating the thermal performance of reflow ovens. The standard tester is built primarily from heat-capacity modules of differing thermal mass — specified to characterize the heat-capacity differences of the various components found in real production. Combined with the R9E3 data recorder, a standard thermal load board and ERES analysis software, it performs a comprehensive process-capability test and analysis of hot-air reflow soldering equipment.
In about 15 minutes it completes a fast, effective evaluation of an oven’s thermal efficiency — used for new-oven acceptance, equipment assessment, rational machine-to-product allocation and scheduling, and to guide energy-saving / emission-reduction and maintenance decisions.
| Model | RE5050D |
|---|---|
| Dimensions | 530 (L) × 500 (W) × 31.5 (H) mm |
| Channels | 30 temperature recording + 3 expansion (empty/full load · hot-air convection velocity · chain temperature) |
| Thermocouple | Type K |
| Measuring range | 0 ~ 350 ℃ |
| Sampling rate | 0.1 ~ 400 s, adjustable |
| Accuracy | ±0.5 ℃ |
| Resolution | 0.1 ℃ |
| Data interface | Universal USB 2.0 |
| Battery | Rechargeable lithium battery |
| Software | ERES analysis software |
| OS | Windows 7 / 8 / 10 / 11 |
| Languages | English · Simplified Chinese · Traditional Chinese |
Specifications per manufacturer datasheet RE5050D V3.5. Subject to change without notice.
From the 30 + 3 channel data set, ERES automatically generates a multi-dimensional report: thermal-efficiency uniformity / symmetry / thermal shock, hot-air convection strength, stability, chain-temperature fluctuation, empty-vs-full-load and ambient-temperature compensation, and CPK capability for peak temperature, hot-air convection and chain speed. It can precisely display the corresponding air volume and heating temperature at any position inside the oven chamber — producing a quantified performance score for the oven.
English specification summary available on request — ask us.
Request pricing, lead time and a North American demo configuration.